PUCHONG, 6 May 2025 — The Malaysia Semiconductor IC Design Park, in collaboration with Arm, today hosted an Industry Briefing and Engagement Session aimed at advancing Malaysia’s ambitions in front-end semiconductor design and innovation. Held at Four Points by Sheraton, the event brought together policymakers, global industry leaders, and local semiconductor stakeholders for a day of strategic discussions, knowledge sharing, and ecosystem-building.
The landmark partnership between Malaysia and Arm, announced in March 2025, is a key pillar of Malaysia’s broader strategy to transition from traditional manufacturing towards an IP-driven innovation economy. Anchored by initiatives such as the Malaysia Semiconductor IC Design Park , the collaboration seeks to catalyze talent development, stimulate high-value research and development, and position Malaysia as a globally competitive hub for next-generation technologies.
The event was officiated with opening remarks by Mr. Yong Kai Ping, Chief Executive Officer of the Selangor Information Technology and Digital Economy Corporation (Sidec), followed by special remarks from Mr Alex Lee, Strategic Business Development Director ARM.
Participants gained valuable insights into the government’s initiatives for the semiconductor industry through a session led by James Chai, Special Officer (Policy) representing the Ministry of Economy Malaysia. The session highlighted the government’s commitment to supporting local design firms and elevating Malaysia’s position within the global semiconductor value chain. Additionally, this session also outlined the application process and qualifying criteria for companies to participate in this high-impact initiative, ensuring industry players are well-informed on how to engage with and benefit from the program.
A key highlight of the session was a session of Arm’s Flexible Access (AFA) program and Compute Subsystem (CSS) solutions , showcasing how Malaysian IC design companies can leverage Arm’s cutting-edge intellectual property, including high-performing Central Processing Units (CPUs), Graphics Processing Units (GPUs), Neural Processing Units (NPUs), and advanced system interconnects. Arm’s emphasis on common softwarestandards and customizable hardware architectures offers Malaysian companies a trusted platform to innovate and differentiate in a rapidly evolving global semiconductor landscape.
This engagement forms part of Malaysia’s national strategy under the New Industrial Master Plan (NIMP) 2030 , which identifies the Electrical and Electronics (E&E) sector as a critical engine of future economic growth. By focusing on research, development, and system-on-chip (SoC) design, Malaysia aims to move up the value chain and retain a greater share of value creation within its borders.
“The Malaysia–Arm partnership is a catalyst for developing a vibrant semiconductor ecosystem where local innovators can thrive,” said Mr. Yong Kai Ping. “Through access to world-class technology platforms and global best practices, we are empowering Malaysian companies to take ownership of their future in the global semiconductor industry.”
The session concluded with Arm engaging in discussions with several Malaysian IC design companies to explore collaboration opportunities, further reinforcing the Government’s commitment to accelerating industry transformation and building a resilient, future-ready semiconductor sector.
Source: malaysiakini
2025-05-06T16:00:00Z